AP1 SOIC24 ZIF 300mil 70-0121 Heat-resistant up to 400°C

Heat-resistant up to 400°C

The Dataman BGA-Bottom-208 is the bottom board of BGA adapter for NXP LPC314x/315x devices in matrix 14x14-4x4

The Dataman BGA-Bottom-79 is the bottom board of BGA adapter for PLD Xilinx Spartan-3AN with balls in matrix 16x16

PF0100 / PF0200) (open socket)

AP1 SOIC24 ZIF 300mil 70-0121 Heat-resistant up to 400°CThe Dataman AP1 SOIC24 ZIF 300mil is a universal module for 300mil SOIC SOP devices up to 24 pins (e. g. PLD STM ST7xxx series Cypress CY8Cxxxxx series) (open socket). The operating (mechanical) life of the ZIF socket is 10,000 actuations. Some adapters are programmer specific and we recommend checking the software for compatibility prior to ordering. Please see our Adapter Selection Guide for more information.