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DiaSec Diamond Wafering Blade - General Purpose Metallography 5in 3 micron Item No: EFR-2008

DiaSec Diamond Wafering Blade - General Purpose Metallography 5in 3 micron Item No: EFR-2008The DiaSec General Purpose Diamond Blade is a great choice for metallurgical sample sectioning. Made with metal bonding, this 5in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert. Diameter: 5in (125mm) Thickness: 0. 020in (0. 5mm) Arbor: 0. 5in (12. 7mm) Item No DS 1005 1 pkg

SKU: 94936216978 · From iglepidom.org

4.5
USD155.00 USD202.00

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Description

Item No: EFR-2008

Applications: Sintered Carbides

Copper alloys

This package includes one roll of 3-7/16-in x 75-ft

DiaSec Diamond Wafering Blade - General Purpose Metallography 5in 3 micron Item No: EFR-2008The DiaSec General Purpose Diamond Blade is a great choice for metallurgical sample sectioning. Made with metal bonding, this 5in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert. Diameter: 5in (125mm) Thickness: 0. 020in (0. 5mm) Arbor: 0. 5in (12. 7mm) Item No DS 1005 1 pkg

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